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| 3.0mmx3.0mm SURFACE MOUNT LED LAMP APKF3030SEXXC/E HYPER ORANGE Features lLOW POWER CONSUMPTION. lONE Description Diode. l3.0mmx3.0mm SMT LED, 2.0mm(MAX.) THICKNESS. lCAN PRODUCE ANY COLOR IN VISIBLE lPACKAGE The Hyper Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting ORANGE CHIP IN ONE PACKAGE. SPECTRUM, INCLUDING WHITE LIGHT. : 1000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1207 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE: APR/25/2003 DRAWN: D.H.FANG PAGE: 1 OF 4 Selection Guide P ar t N o . APKF3030SEXXC /E Dic e HYPER ORANGE (InGaAlP) L en s Ty p e WATER C LEAR Iv (m c d ) @ 20m A Mi n . 180 Ty p . 400 V i ew i n g An g le 21/2 100 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Sy m b o l p e a k D 1/2 C VF IR P ar am et er Peak Wavelength D omi nate Wavelength Spectral Li ne Half-wi dth C apaci tance Forward Voltage Reverse C urrent D ev i c e Hyper Orange Hyper Orange Hyper Orange Hyper Orange Hyper Orange Hyper Orange Ty p . 630 621 20 25 2.0 2.5 10 Max . Un its nm nm nm pF V uA Tes t C o n d i t i o n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Absolute Maximum Ratings at TA=25C P ar am et er Power di ssi pati on H y p er Or an g e 150 30 5 Un its mW mA V mA Reverse Voltage Peak Forward C urrent [1] D C Forward C urrent 195 -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Operati ng/Storage Temperature SPEC NO: DSAD1207 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE: APR/25/2003 DRAWN: D.H.FANG PAGE: 2 OF 4 Hyper Orange APKF3030SEXXC/E SPEC NO: DSAD1207 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE: APR/25/2003 DRAWN: D.H.FANG PAGE: 3 OF 4 APKF3030SEXXC/E SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1207 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE: APR/25/2003 DRAWN: D.H.FANG PAGE: 4 OF 4 |
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